DPI delivers a broad range of analog, wireless, and RF (Mixed-Signal) design services. These include high-level physical design verification, layout implementation and drivers, 3D EM and full-chip simulation, and package, thermal, reliability and yield analysis. Even in the most demanding applications, Through our engineering excellence and continuous focus on improvement, we have built an outstanding reputation for innovation, quality deliverables and performance.

Analog & Mixed Signal Layout Expertise

• Exposure to multiple technology nodes, TSMC FinFet up to 3nm & GF – FDSOI
• High speed design in the range of 32/64 Gbps, Power management, Memory, RF, Data Converters and pure analog modules.
• IP delivery – complete ownership and delivery of IP starting from Transistor level to Bump and ESD planning.
• Module or block level delivery engagement.
• EMIR, thermal aware EMIR, DFM, Density, Client specific custom rules and support to PD/chip level issues.
• Post layout support.
• Skill automation for productive layouts